IEC 62439-5 Ed. 1.0 en:2010
Industrial communication networks - High availability automation networks - Part 5: Beacon Redundancy Protocol (BRP)
standard by International Electrotechnical Commission, 02/26/2010
IEC 62439-2 Ed. 1.0 b:2010
Industrial communication networks - High availability automation networks - Part 2: Media Redundancy Protocol (MRP)
standard by International Electrotechnical Commission, 02/26/2010
IEC 62439-5 Ed. 1.0 b:2010
Industrial communication networks - High availability automation networks - Part 5: Beacon Redundancy Protocol (BRP)
standard by International Electrotechnical Commission, 02/26/2010
IEC 62439-1 Ed. 1.0 b:2010
Industrial communication networks - High availability automation networks - Part 1: General concepts and calculation methods
standard by International Electrotechnical Commission, 02/25/2010
IEC 62439-1 Ed. 1.0 en:2010
Industrial communication networks - High availability automation networks - Part 1: General concepts and calculation methods
standard by International Electrotechnical Commission, 02/25/2010
IEC 60191-6-19 Ed. 1.0 b:2010
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
standard by International Electrotechnical Commission, 02/25/2010
IEC 60317-22 Ed. 3.1 b:2010
Specifications for particular types of winding wires - Part 22: Polyester or polyesterimide enamelled round copper wire overcoated with polyamide, class 180 CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 02/25/2010
IEC 62439-3 Ed. 1.0 en:2010
[ Withdrawn ]
Industrial communication networks - High availability automation networks - Part 3: Parallel Redundancy Protocol (PRP) and High-availability Seamless Redundancy (HSR)
standard by International Electrotechnical Commission, 02/25/2010
IEC 60317-18 Ed. 3.1 b:2010
[ Withdrawn ]
Specifications for particular types of winding wires - Part 18: Polyvinyl acetal enamelled rectangular copper wire, class 120 CONSOLIDATED EDITION
standard by International Electrotechnical Commission, 02/25/2010