IEC 61191-6 Ed. 1.0 b:2010
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
standard by International Electrotechnical Commission, 01/14/2010
IEC 62333-3 Ed. 1.0 b:2010
Noise suppression sheet for digital devices and equipment - Part 3: Characterization of parameters of noise suppression sheet
standard by International Electrotechnical Commission, 01/14/2010
IEC 61391-2 Ed. 1.0 en:2010
Ultrasonics - Pulse-echo scanners - Part 2: Measurement of maximum depth of penetration and local dynamic range
standard by International Electrotechnical Commission, 01/14/2010
IEC 61340-4-8 Ed. 1.0 en:2010
Electrostatics - Part 4-8: Standard test methods for specific applications - Discharge shielding - Bags
standard by International Electrotechnical Commission, 01/14/2010
IEC 61340-4-7 Ed. 1.0 en:2010
Electrostatics - Part 4-7: Standard test methods for specific applications - Ionization
standard by International Electrotechnical Commission, 01/14/2010
IEC 61340-4-6 Ed. 1.0 en:2010
Electrostatics - Part 4-6: Standard test methods for specific applications - Wrist straps
standard by International Electrotechnical Commission, 01/14/2010
IEC 61300-2-1 Ed. 3.0 b COR.1:2010
Corrigendum 1 - Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-1: Tests - Vibration (sinusoidal)
Corrigenda by International Electrotechnical Commission, 01/14/2010
IEC 60191-6-18 Ed. 1.0 b:2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
standard by International Electrotechnical Commission, 01/07/2010
IEC 60172 Amd.2 Ed. 3.0 b:2010
[ Withdrawn ]
Amendment 2 - Test procedure for the determination of the temperature index of enamelled winding wires
Amendment by International Electrotechnical Commission, 01/07/2010