IPC EMBPAS03
IPC International Conference on Embedded Passives "The Faster and Cleaner Electronic Signals for the Future" - Northbrook, IL - June 2003
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003
IPC 8413-1
Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing
standard by Association Connecting Electronics Industries, 04/01/2003
IPC 9500-K
Assembly Process Component Simulations, Guidelines and Classifications Package
standard by Association Connecting Electronics Industries, 03/01/2003
IPC J-STD-027
Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
standard by Association Connecting Electronics Industries, 02/01/2003
IPC J-STD-002B
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 02/01/2003
IPC 4552
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards, includes Amendment 1 and 2
standard by Association Connecting Electronics Industries, 10/01/2002