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ASTM B734-97(2003)e1

ASTM B734-97(2003)e1 Standard Specification for Electrodeposited Copper for Engineering Uses

standard by ASTM International, 02/10/2003

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1.1 This specification covers requirements for electrodeposited coatings of copper used for engineering purposes. Examples include surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interferences (EMI) shielding in electronic circuitry, and in certain joining operations.

1.2 This specification is not intended for electrodeposited copper when used as a decorative finish, or as an undercoat for other decorative finishes.

1.3 This specification is not intended for electrodeposited copper when used for electroforming.

 
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