Full Description

1.1This guide covers proper handling and application of a flexible circuit membrane switch, or printed electronic assembly to its final support structure to avoid mechanical or electrical failure.

1.2Damage of internal tactile devices or surface mount device (SMD) components can occur with excessive flexing or bending during lamination, repositioning, from uneven support surface, air entrapment, or pressing keys when unsupported.

1.3Design considerations and material selection can impact the membrane switch or the printed electronic devices ability to endure the mechanical stress that can occur in handling, application and use. These should be considered as early as possible in the design phase.

1.4Recent advancements in printed electronic polymer materials have shown increased reliability from flexing and creasing, replacing copper flex circuits in many cases.

1.5This international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for the Development of International Standards, Guides and Recommendations issued by the World Trade Organization Technical Barriers to Trade (TBT) Committee.