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BS 10/30211454 DC

BS 10/30211454 DC

BS 10/30211454 DC BS EN 62047-13. Semiconductor devices. Micro-electromechanical devices. Part 13. Bend- and shear- test methods of measuring adhesive strength for MEMS structures

standard by BSI Group, 02/22/2010

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Cross References:
IEC 62047-2


All current amendments available at time of purchase are included with the purchase of this document.

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Published: 02/22/2010 Number of Pages: 13

 
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