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BS DD IEC/PAS 61249-3-1:2007

BS DD IEC/PAS 61249-3-1:2007 Materials for printed boards and other interconnecting structures. Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

standard by BSI Group, 10/31/2007

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Cross References:
JPCA-TD01
JIS C 5603
JIS C 6471
JIS C 6472
JIS C 6515
IEC 60194
IPC-4204
ASTM D149
ASTM D150
ASTM D882

 
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