IEC 61189-2-807 Ed. 1.0 b:2021

IEC 61189-2-807 Ed. 1.0 b:2021 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

standard by International Electrotechnical Commission, 09/01/2021

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This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td)
of base laminate materials using thermogravimetric analysis (TGA).

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Edition: 1.0 Published: 09/01/2021 ISBN(s): 9782832210198 Number of Pages: 22 File Size: 1 file , 1 MB Note: This product is unavailable in Ukraine, Russia, Belarus

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IEC 61189-2-807 Ed. 1.0 b:2021

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