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IEC 61188-6-1 Ed. 1.0 b:2021

IEC 61188-6-1 Ed. 1.0 b:2021 Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

standard by International Electrotechnical Commission, 02/23/2021

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IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.

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Edition: 1.0 Published: 02/23/2021 Number of Pages: 63 File Size: 1 file , 5.7 MB Note: This product is unavailable in Ukraine, Russia, Belarus

 
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