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IEC 60749-20 Ed. 3.0 b:2020
IEC 60749-20 Ed. 3.0 b:2020 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
standard by International Electrotechnical Commission, 08/01/2020
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M00012387
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This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
