IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
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Edition: 1.0 Published: 09/29/2010 Number of Pages: 32 File Size: 1 file , 490 KB Note: This product is unavailable in Ukraine, Russia, Belarus
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