Cart
0
0
item(s)
-
$0.00
No products
To be determined
Shipping
$0.00
Total
Quantity
Total
Product successfully added to your shopping cart
There are 0 items in your cart.
There are 0 items in your cart.
Total
IEC 60191-6-18 Ed. 1.0 b COR. 2:2010
IEC 60191-6-18 Ed. 1.0 b COR. 2:2010 Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Corrigenda by International Electrotechnical Commission, 07/28/2010
Reduced price!
M00002517
New product
