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IEC 61190-1-3 Amd.1 Ed. 2.0 b:2010
IEC 61190-1-3 Amd.1 Ed. 2.0 b:2010 Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Amendment by International Electrotechnical Commission, 06/10/2010
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M00002622
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