IEC 60512-9-5:2010 when required by the detail specification, is used for testing connectors within the scope of technical committee 48. It may also be used for similar devices when specified in a detail specification. The object of this standard is to detail a standard method for subjecting solderless connections to thermal stress conditioning by cyclic current loading.
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Edition: 1.0 Published: 03/17/2010 Number of Pages: 9 File Size: 1 file , 810 KB Note: This product is unavailable in Ukraine, Russia, Belarus
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