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IEC 62047-16 Ed. 1.0 b:2015

IEC 62047-16 Ed. 1.0 b:2015

IEC 62047-16 Ed. 1.0 b:2015 Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

standard by International Electrotechnical Commission, 03/05/2015

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IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 to 10 in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.

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Edition: 1.0 Published: 03/05/2015 Number of Pages: 21 File Size: 1 file , 420 KB

 
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