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IEC 60191-5 Ed. 2.0 b:1997

IEC 60191-5 Ed. 2.0 b:1997

IEC 60191-5 Ed. 2.0 b:1997 Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

standard by International Electrotechnical Commission, 04/23/1997

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Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.

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Edition: 2.0 Published: 04/23/1997 Number of Pages: 71 File Size: 1 file , 570 KB

 
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