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IEC 60191-6-8 Ed. 1.0 b:2001

IEC 60191-6-8 Ed. 1.0 b:2001

IEC 60191-6-8 Ed. 1.0 b:2001 Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

standard by International Electrotechnical Commission, 08/27/2001

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IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.

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Edition: 1.0 Published: 08/27/2001 Number of Pages: 22 File Size: 1 file , 330 KB

 
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