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IEC 60191-6-3 Ed. 1.0 b:2000
IEC 60191-6-3 Ed. 1.0 b:2000 Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
standard by International Electrotechnical Commission, 09/29/2000
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M00008555
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