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IEC 61191-3 Ed. 1.0 b:1998

IEC 61191-3 Ed. 1.0 b:1998

IEC 61191-3 Ed. 1.0 b:1998 [ Withdrawn ] Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

standard by International Electrotechnical Commission, 08/28/1998

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Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

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Edition: 1.0 Published: 08/28/1998 Number of Pages: 31 File Size: 1 file , 530 KB

 
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