Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous edition deal with: use of four layer test boards; sample tolerance range requirements; use of platings other than tin or tin/lead.
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Edition: 3.0 Published: 01/10/2008 Number of Pages: 72 File Size: 1 file , 1.1 MB
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