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IEC 60749-21 Ed. 1.0 b:2004

IEC 60749-21 Ed. 1.0 b:2004

IEC 60749-21 Ed. 1.0 b:2004 [ Withdrawn ] Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

standard by International Electrotechnical Commission, 03/15/2004

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Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.

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Edition: 1.0 Published: 03/15/2004 Number of Pages: 45 File Size: 1 file , 850 KB

 
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