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IEC 60749-25 Ed. 1.0 b:2003

IEC 60749-25 Ed. 1.0 b:2003

IEC 60749-25 Ed. 1.0 b:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

standard by International Electrotechnical Commission, 07/11/2003

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Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

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Edition: 1.0 Published: 07/11/2003 Number of Pages: 25 File Size: 1 file , 650 KB

 
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