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IEC 60749-19 Ed. 1.0 b:2003

IEC 60749-19 Ed. 1.0 b:2003

IEC 60749-19 Ed. 1.0 b:2003 Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

standard by International Electrotechnical Commission, 02/13/2003

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Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.

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Edition: 1.0 Published: 02/13/2003 Number of Pages: 11 File Size: 1 file , 200 KB

 
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