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IEC 60749-15 Ed. 1.0 b:2003

IEC 60749-15 Ed. 1.0 b:2003

IEC 60749-15 Ed. 1.0 b:2003 [ Withdrawn ] Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

standard by International Electrotechnical Commission, 02/07/2003

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Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

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Edition: 1.0 Published: 02/07/2003 Number of Pages: 11 File Size: 1 file , 230 KB

 
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