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IEC 62418 Ed. 1.0 b:2010

IEC 62418 Ed. 1.0 b:2010

IEC 62418 Ed. 1.0 b:2010 Semiconductor devices - Metallization stress void test

standard by International Electrotechnical Commission, 04/22/2010

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IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

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Edition: 1.0 Published: 04/22/2010 Number of Pages: 34 File Size: 1 file , 990 KB

 
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