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IEC 60191-6-18 Ed. 1.0 b:2010

IEC 60191-6-18 Ed. 1.0 b:2010

IEC 60191-6-18 Ed. 1.0 b:2010 Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

standard by International Electrotechnical Commission, 01/07/2010

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IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

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Edition: 1.0 Published: 01/07/2010 Number of Pages: 40 File Size: 1 file , 1.1 MB

 
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