Full Description

Outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices. Provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. IEC 60068-2-54 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads. The main changes from the previous edition are as follows: Inclusion of lead-free alloy test conditions; Inclusion of new fluxes for testing, reflecting development of fluxes that have happened in the industry in the past 20 years; Inclusion of new component types, and updating test parameters for the whole component list.

Product Details

Edition: 2.0 Published: 05/09/2007 Number of Pages: 25 File Size: 1 file , 230 KB