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IEC 61188-5-6 Ed. 1.0 b:2003

IEC 61188-5-6 Ed. 1.0 b:2003

IEC 61188-5-6 Ed. 1.0 b:2003 Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

standard by International Electrotechnical Commission, 01/23/2003

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Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

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Edition: 1.0 Published: 01/23/2003 Number of Pages: 37 File Size: 1 file , 380 KB

 
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IEC 60745-2-2 Ed. 2.0 b:2003 1xIEC 60745-2-2 Ed. 2.0... $21.15
IEC 61290-10-2 Ed. 1.0 b:2003 1xIEC 61290-10-2 Ed. 1.0... $27.00
IEC 60745-2-1 Ed. 2.0 b:2003 1xIEC 60745-2-1 Ed. 2.0... $36.90
IEC 60746-2 Ed. 2.0 en:2003 1xIEC 60746-2 Ed. 2.0... $57.60
IEC 60335-2-23 Ed. 5.0 b:2003 1xIEC 60335-2-23 Ed. 5.0... $54.45
IEC 61753-031-6 Ed. 2.0 b:2014 1xIEC 61753-031-6 Ed.... $52.65

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