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IEC 60749-16 Ed. 1.0 b:2003

IEC 60749-16 Ed. 1.0 b:2003

IEC 60749-16 Ed. 1.0 b:2003 Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

standard by International Electrotechnical Commission, 01/17/2003

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Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

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Edition: 1.0 Published: 01/17/2003 Number of Pages: 13 File Size: 1 file , 200 KB

 
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