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IEC 61192-3 Ed. 1.0 b:2002

IEC 61192-3 Ed. 1.0 b:2002

IEC 61192-3 Ed. 1.0 b:2002 [ Withdrawn ] Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

standard by International Electrotechnical Commission, 12/17/2002

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Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

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Edition: 1.0 Published: 12/17/2002 Number of Pages: 93 File Size: 1 file , 7.3 MB

 
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