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IEC 60749-22 Ed. 1.0 b:2002

IEC 60749-22 Ed. 1.0 b:2002

IEC 60749-22 Ed. 1.0 b:2002 Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

standard by International Electrotechnical Commission, 09/12/2002

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Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

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Edition: 1.0 Published: 09/12/2002 Number of Pages: 41 File Size: 1 file , 720 KB

 
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