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IEC 61188-5-1 Ed. 1.0 b:2002

IEC 61188-5-1 Ed. 1.0 b:2002

IEC 61188-5-1 Ed. 1.0 b:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

standard by International Electrotechnical Commission, 07/12/2002

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Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

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Edition: 1.0 Published: 07/12/2002 Number of Pages: 141 File Size: 1 file , 6.2 MB

 
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