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IPC 9631

IPC 9631

IPC 9631 User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

standard by Association Connecting Electronics Industries, 12/01/2010

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IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and calibration of that equipment.

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Published: 12/01/2010 Number of Pages: 24 File Size: 1 file , 1.1 MB

 
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BS 12/30260251 DC 1xBS 12/30260251 DC $67.50
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BS 12/30217461 DC 1xBS 12/30217461 DC $67.50
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BS 12/30238456 DC 1xBS 12/30238456 DC $67.50

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