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1xAS 61952:2020
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1xAPI RP 687
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1xAATCC EP07-2021
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IPC J-STD-003D
IPC J-STD-003D Solderability Tests for Printed Boards
standard by Association Connecting Electronics Industries, 10/01/2022
Full Description
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes (PTHs). This standard is intended for use by both user and supplier.
This standard is not intended to verify the potential of successful processing at assembly or to evaluate design impact on wettability. This standard describes procedures or methods to determine the acceptable wettability of a surface finish. Wettability can be affected by handling, finish application, and environmental conditions.
