Cart
10
10
item(s)
-
$744.50
-
1xUL Subject 508A
$74.85 -
1xIPC 7526A
$76.95 -
1xUL 4600
$134.55 -
1xUL Subject 8801
$74.85 -
1xIPC ENVIRONMENT
$71.10 -
1xIPC A-47-G
$89.55 -
1xUL 15027-2
$37.50 -
1xPIP RESP73V-97
$89.55 -
1xAS ISO 3164:2020
$20.75 -
1xUL Subject 508A
$74.85
No products
To be determined
Shipping
$744.50
Total
Quantity
Total
Product successfully added to your shopping cart
There are 10 items in your cart.
There are 10 items in your cart.
Total
$744.50
IPC 4555
IPC 4555 Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2022
Reduced price!
M00001641
New product
Full Description
This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High Temperature) for Pb-free soldering. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).
